aba-31563 3.5 ghz broadband silicon rfic amplifer data sheet description avagos aba-31563 is an economical, easy-to-use, internally 50 matched, silicon monolithic broadband amplifer that ofers excellent gain and broadband response from dc to 3.5 ghz. packaged in an ultra-miniature sot-363 package, it requires half the board space of a sot-143 package. at 2 ghz, the aba-31563 ofers a small-signal gain of 21.5 db, output p1db of 2.2 dbm and 13.1 dbm output third order intercept point. it is suitable for use as wideband applications. they are designed for low cost gain blocks in cellular applications, dbs tuners, lnb and other wireless communication systems. aba-31563 is fabricated using avagos hp25 silicon bipolar process, which employs a double-difused single polysilicon process with self-aligned submicron emitter geometry. the process is capable of simultaneous high f t and high npn breakdown (25 ghz f t at 6v bvceo). the process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. features ? operating frequency dc ~ 3.5ghz ? 21.5 db gain ? vswr < 2.0 throughout operating frequency ? 2.2 dbm output p1db ? 13.1 dbm output ip3 ? 3.8 db noise figure ? unconditionally stable ? single 3v supply (id = 14 ma) ? lead-free applications ? amplifer for cellular, cordless, special mobile radio, pcs, ism, wireless lan, dbs, tvro, and tv tuner applications surface mount package sot-363/sc70 pin connections and package marking simplifed schematic note: top view. package marking provides orientation and identifcation. x is the date code. attention: observe precautions for handling electrostatic sensitive devices. esd machine model (class a) esd human body model (class 1b) refer to avago application note a004r: electrostatic discharge damage and control. vcc gnd 3 1kx input gnd 1 gnd 2 output & vcc vcc ground 1 ground 2 ground 3 rf input rf output & vcc
2 aba-31563 absolute maximum ratings [1] symbol parameter units absolute max. v cc device voltage, rf output to ground (t = 25c) v 6 p in cw rf input power (vcc = 3v) dbm 15 p diss total power dissipation [3] w 0.3 t j junction temperature c 150 t stg storage temperature c -65 to 150 notes: 1. operation of this device in excess of any of these limits may cause permanent damage. 2. thermal resistance measured using 150c liquid crystal measurement technique. 3. board (package belly) temperature, tc, is 25c. derate 2.3 mw/c for tc > 120.8c. electrical specifcations t c = +25c, z o = 50 , p in = -30 dbm, v cc = 3v, freq = 2 ghz, unless stated otherwise. symbol parameter and test condition units min. typ. max. std dev. gp [1] power gain (|s 21 | 2 ) db 20.0 21.5 ? gp power gain flatness, f = 0.1 ~ 2.5 ghz db 0.2 f = 0.1 ~ 3.5 ghz 1.3 nf [1] noise figure db 3.8 4.8 p1db [1] output power at 1db gain compression dbm 2.2 oip3 [1] output third order intercept point dbm 13.1 vswr in [1] input vswr <1.5 vswr out [1] output vswr <1.5 icc [1] device current ma 14 16 td [1] group delay ps 140 notes: 1. measurements taken on 50 test board shown on figure 1. excess circuit losses had been de-embedded from actual measurements. standard deviation and typical data based on at least 500 parts sample size from 2 wafer lots. future wafers allocated to this product may have nominal values anywhere within the upper and lower spec limits. figure 1. aba-31563 production test circuit. thermal resistance [2] (vcc = 3v) j-c = 125c/w rf outpu t rf input vcc rfc 33 nh c block 1 nf c block 1 nf 1kx c bypass 100 pf c bypass 1000 pf
3 aba-31563 typical performance t c = +25c, z o = 50, v cc = 3v unless stated otherwise. frequency (ghz) figure 2. gain vs. frequency and voltage. gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 3. gain vs. frequency and temperature. gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 +85c +25c -40c frequency (ghz) figure 4. noise figure vs. frequency and voltage. nf (db) 0 6 5.5 5 4.5 4 3.5 3 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 5. noise figure vs. frequency and temperature. nf (db) 0 6 5.5 5 4.5 4 3.5 3 4 1 0.5 2 2.5 3 1.5 3.5 +85c +25c -40c frequency (ghz) figure 6. output power for 1 db gain compression vs. frequency and voltage. p1db (dbm) 0 6 4 2 0 -2 -4 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 7. output power for 1 db gain compression vs. frequency and temperature. p1db (dbm) 0 6 4 2 0 -2 -4 4 1 0.5 2 2.5 3 1.5 3.5 +85c +25c -40c
4 aba-31563 typical performance, continued t c = +25c, z o = 50, v cc = 3v unless stated otherwise. frequency (ghz) figure 8. output ip3 vs. frequency and voltage. oip3 (dbm) 0 20 16 12 8 4 0 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 9. output ip3 vs. frequency and temperature. oip3 (dbm) 0 20 16 12 8 4 0 4 1 0.5 2 2.5 3 1.5 3.5 +85c +25c -40c frequency (ghz) figure 10. input and output vswr vs. frequency. vswr 1.8 1.6 1.4 1.2 1.0 vswr in vwsr out 04 1 0.5 2 2.5 3 1.5 3.5 voltage (v) figure 11. supply current vs. voltage and temperature. icc (ma) 0 70 60 50 40 30 20 10 0 2 1 45 6 3 7 +85c +25c -40c
5 aba-31563 typical scattering parameters t c = +25c, z o = 50, v cc = 3v, unless stated otherwise freq s 11 s 11 s 21 s 21 s 21 s 12 s 12 s 22 s 22 k (ghz) mag. ang. db mag. ang. mag. ang. mag. ang. factor 0.10 0.05 3.1 21.25 11.54 -4.1 0.03 -0.6 0.23 -4.9 1.800 0.20 0.06 1.6 21.26 11.56 -8.3 0.03 -0.7 0.23 -9.3 1.800 0.30 0.06 1.1 21.28 11.59 -12.5 0.02 -0.6 0.23 -13.6 1.800 0.40 0.06 0.3 21.31 11.62 -16.9 0.02 -0.4 0.23 -18.0 1.800 0.50 0.07 18.4 21.3 11.62 -21.7 0.02 -0.4 0.21 -18.4 1.800 0.60 0.08 21.0 21.3 11.61 -26.3 0.02 0.0 0.21 -20.1 1.900 0.70 0.09 21.0 21.31 11.62 -30.8 0.02 0.8 0.21 -21.9 1.900 0.80 0.10 20.7 21.31 11.62 -35.3 0.02 1.5 0.21 -24.0 1.900 0.90 0.10 18.8 21.32 11.64 -39.8 0.02 2.4 0.20 -26.1 1.900 1.00 0.11 19.2 21.32 11.64 -44.4 0.02 3.2 0.20 -28.1 1.900 1.10 0.12 15.5 21.32 11.65 -48.9 0.02 4.2 0.20 -30.2 1.900 1.20 0.12 14.0 21.32 11.64 -53.4 0.02 5.4 0.20 -32.2 1.900 1.30 0.12 12.4 21.33 11.65 -58.0 0.02 6.5 0.19 -34.6 1.900 1.40 0.13 9.5 21.32 11.64 -62.6 0.02 7.7 0.19 -36.9 1.900 1.50 0.13 7.5 21.35 11.69 -67.2 0.02 8.9 0.18 -39.1 1.900 1.60 0.14 5.0 21.37 11.71 -71.9 0.02 10.2 0.17 -41.2 1.900 1.70 0.14 3.7 21.36 11.70 -76.8 0.02 11.5 0.17 -43.1 1.900 1.80 0.15 0.5 21.36 11.70 -81.4 0.02 12.5 0.16 -44.7 1.900 1.90 0.15 -2.6 21.37 11.71 -86.2 0.02 13.4 0.15 -46.1 1.900 2.00 0.16 -4.2 21.37 11.71 -91.2 0.02 14.8 0.14 -47.8 1.900 2.20 0.17 -9.7 21.33 11.66 -100.7 0.02 16.8 0.12 -48.2 1.800 2.40 0.17 -15.7 21.32 11.64 -110.8 0.03 18.5 0.10 -46.8 1.800 2.60 0.18 -20.1 21.21 11.50 -121.2 0.03 21.0 0.08 -39.7 1.800 2.80 0.19 -27.1 21.1 11.35 -131.2 0.03 21.9 0.07 -23.6 1.700 3.00 0.19 -34.0 20.94 11.15 -141.5 0.03 22.3 0.08 -9.9 1.700 3.20 0.20 -41.7 20.73 10.87 -152.0 0.03 23.2 0.08 0.4 1.700 3.40 0.20 -48.8 20.43 10.51 -162.2 0.03 24.2 0.10 6.3 1.600 3.60 0.20 -57.6 20.12 10.14 -172.3 0.03 24.6 0.11 7.6 1.600 3.80 0.19 -67.0 19.77 9.74 177.7 0.03 25.2 0.12 6.6 1.600 4.00 0.19 -76.0 19.38 9.31 167.9 0.04 25.2 0.13 6.6 1.600 4.20 0.18 -85.5 18.94 8.85 158.6 0.04 25.8 0.14 5.7 1.600 4.40 0.17 -98.2 18.57 8.48 149.1 0.04 24.9 0.14 1.6 1.600 4.60 0.16 -111.5 18.16 8.09 139.4 0.04 24.2 0.14 -2.9 1.600 4.80 0.15 -123.8 17.66 7.64 129.7 0.04 23.2 0.15 -6.5 1.600 5.00 0.14 -136.6 17.08 7.14 120.6 0.05 22.0 0.15 -10.1 1.600 5.20 0.13 -149.9 16.52 6.70 111.9 0.05 20.6 0.15 -15.1 1.600 5.40 0.13 -162.5 15.9 6.24 103.5 0.05 19.2 0.15 -19.7 1.600 5.60 0.14 -175.1 15.37 5.87 95.5 0.06 16.9 0.15 -27.2 1.600 5.80 0.14 170.6 14.81 5.50 87.5 0.06 13.9 0.14 -33.8 1.600 6.00 0.14 164.1 14.22 5.14 80.0 0.06 11.8 0.13 -38.1 1.700
6 ordering information part number devices per container container aba-31563-tr1g 3000 7" reel ABA-31563-TR2G 10000 13" reel aba-31563-blkg 100 antistatic bag note: only lead-free option available. package dimensions outline 63 (sot-363/sc-70) device models refer to avagos web site www.avagotech.com/view/rf recommended pcb pad layout for avago's sc70 6l/sot-363 products e he d e a1 b a a2 q1 l c dimensions (mm) min. 1.15 1.80 1.80 0.80 0.80 0.00 0.10 0.15 0.10 0.10 max. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.30 0.20 0.30 symbol e d he a a2 a1 q1 e b c l notes: 1. all dimensions are in mm. 2. dimensions are inclusive of plating. 3. dimensions are exclusive of mold flash & metal burr. 4. all specifications comply to eiaj sc70. 5. die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. package surface to be mirror finish. 0.650 bcs 0.026 0.079 0.018 0.039 dimensions in inches.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. obsoletes 5989-1968en av02-1782en - february 11, 2009 device orientation tape dimensions and product orientation for outline 63 user feed direction cover tape carrier tape reel end vie w 8 mm 4 mm top view (package marking example orientation shown.) 1kx 1kx 1kx 1kx p p 0 p 2 f w c d 1 d e a 0 10 max. t 1 (carrier tape thickness) t t (cover tape thickness) 10 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.50 0.10 4.00 0.10 1.75 0.10 0.061 + 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 + 0.30 - 0.10 0.254 0.02 0.315 + 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.40 0.10 0.062 0.001 0.205 + 0.004 0.0025 0.0004 cover tape
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